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MLCAD Symposium 2025

7th ACM/IEEE International Symposium on Machine Learning for CAD
September 8 to 10, 2025
Chaminade Resort, Santa Cruz, California


Important Dates

MLCAD 2025 Regular and industry papers

Abstract due: May 16, 2025 (AOE)
Full manuscript due: May 23, 2025 (AOE)
Notification: July 7, 2025
Camera-Ready Version: July 25, 2025
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MLCAD 2024 TODAES Special Issue

Submissions deadline: March 5, 2025
First-round review decisions: May 5, 2025
Deadline for revision submissions: June 5, 2025
Notification of final decisions: July 5, 2025
Tentative publication: Summer 2025


Location

@ Chaminade Resort, Santa Cruz, California (Photos credit: logansworldphotography @ Instagram)


Announcements

  • Submission link through OpenReview is ready here

About

The symposium focuses on Machine Learning (ML) applications to all aspects of CAD for electronic circuits, chips and systems. It is sponsored by IEEE CEDA (Council on Electronic Design Automation) and ACM SIGDA (Special Interest Group on Design Automation).  MLCAD 2025 will start with the welcome reception in the evening of September 7, 2025. Papers and presentations should cover one or more aspects of applying machine learning and AI to enhance CAD of chip designs. Such aspects include, but are not limited to, algorithms, software, models, example applications, benchmarking, and innovative solutions such as Large Language Models for CAD.


Committees

General Chairs
Jiang Hu, Texas A&M University
Yibo Lin, Peking University

Technical Program Chairs
Youngsoo Shin, Korea Advanced Institute of Science & Technology (KAIST)
Cunxi Yu, University of Maryland

Contest Chair
Vidya A. Chhabria, Arizona State University

Industrial and Special Session Chair
Vishal Khandelwal, Synopsys

Publication Chair
Matthew Guthaus, University of California, Santa Cruz

Publicity Chair
Cong “Callie” Hao, Georgia Institute of Technology