Important Dates

---

Announcements

• 2/6/2026 – Submission link is open.
• 1/14/2026 – Call for contribution is updated.
• 1/10/2026 – MLCAD’26 site is on live!

---

About

The symposium focuses on Machine Learning (ML) applications to all aspects of CAD for electronic circuits, chips and systems. It is sponsored by IEEE CEDA (Council on Electronic Design Automation) and ACM SIGDA (Special Interest Group on Design Automation).  MLCAD 2025 will start with the welcome reception in the evening of September 7, 2025. Papers and presentations should cover one or more aspects of applying machine learning and AI to enhance CAD of chip designs. Such aspects include, but are not limited to, algorithms, software, models, example applications, benchmarking, and innovative solutions such as Large Language Models for CAD.

---

Sponsors

---

Committees

General Chairs	Yibo Lin, Peking University
	Youngsoo Shin, Korea Advanced Institute of Science & Technology (KAIST)
Technical Program Chairs	Cunxi Yu, University of Maryland
	Vidya A. Chhabria, Arizona State University
Industrial Chairs	Jeong-Taek Kong, SungKyunKwan University
	Yu Huang, Hisilicon
Special Session Chairs	Matthew Guthaus, UC Santa Cruz
	Lorenzo Servadei, Sony AI
Local Arrangement Chair	SoYoung Kim, SungKyunKwan University
Finance Chair	Daijoon Hyun, Cheongju University
Publication Chair	Ioannis Savidis, Drexel University
Strategic Initiatives Chair	Igor Markov, Synopsys
Publicity Chair	Cong “Callie” Hao, Georgia Institute of Technology
Artifact Evaluation Chair	Caiwen Ding, University of Minnesota
Steering Committee	Marilyn Wolf, University of Nebraska-Lincoln
	Paul Franzon, North Carolina State University
	Ulf Schlichtmann, Technical University of Munich
	Andrew B. Kahng, University of California San Diego
	Hussam Amrouch, Technical University of Munich