Call for paper: download
Abstract Submission: May 25, 2024(AoE) through OpenReview
Full Paper Submission: June 01, 2024(AoE) through OpenReview
Notification: July 13, 2024
Artifact submission (optional): July 27, 2024
Camera Ready: July 31, 2024
Submissions should be full-length papers of up to six pages (PDF format, double-column, US letter size, using the ACM format). Submissions must be anonymous to allow a double-blind review process. Papers must be at most 6 pages. References and appendices are not included in the page limit. Submitted papers must describe original work that has not been published/accepted or is currently under review by another conference, symposium, or journal will be rejected. Submissions for which pre-prints are available (e.g., on arXiv) are allowed. Note, however, that the authors are expected to follow all reasonable efforts to ensure that the submission is compliant with the double-blind review process.
OpenReview Platform
This year, MLCAD will be using OpenReview to encourage transparency and a higher-quality review process. OpenReview’s open discussion format encourages more extensive and constructive feedback from a broader community, not just designated reviewers. This can lead to better-quality revisions, collaborations, and more robust research outcomes.
Note: This year, the OpenReview platform will be used solely for managing the submission and review process. Reviews of papers and rejected papers will not be made publicly available. Only the PDFs of accepted papers will be published.
Artifact Evaluation
For the first time in the EDA community, MLCAD will implement an Artifact Evaluation (AE) initiative this year to enhance the reproducibility and transparency of research. Artifact Evaluation plays a crucial role in advancing the scientific community by ensuring that research results are reproducible and reliable. By participating in this process, authors will contribute to the integrity and robustness of the field, facilitating future research and collaboration.
We will invite the authors of accepted MLCAD 2024 papers to optionally submit their artifacts to be assessed based on the Artifact Evaluation policies at ACM. Papers that successfully go through this process will receive a set of badges of approval that will appear on the final version of the published manuscript. MLCAD will also have the best artifact award and three travel grants for authors who successfully submit and receive both badges. More details can be found on the GitHub Page.
Timeline
Artifact submission deadline: July 27
Initial questions to authors, if any: Aug 6
Artifact evaluation decisions: Aug 13
Camera-ready submission with badges: Aug 14
Submit your artifact evaluation abstracts (camera-ready paper with an abstract appendix) via OpenReview.
Journal Special Issue
Following MLCAD 2024, ACM Transactions on Design Automation of Electronic Systems (TODAES) will issue a Call for Papers for a Special Issue on Machine Learning for CAD/EDA, to which you are invited to submit expanded versions of your MLCAD paper.
ACM and IEEE Policies
(1) By submitting your article to an ACM Publication, you are hereby acknowledging that you and your co-authors are subject to all ACM Publications Policies, including ACM’s new Publications Policy on Research Involving Human Participants and Subjects. Alleged violations of this policy or any ACM Publications Policy will be investigated by ACM and may result in a full retraction of your paper, in addition to other potential penalties, as per ACM Publications Policy.
(2) Please ensure that you and your co-authors obtain an ORCID ID, so you can complete the publishing process for your accepted paper. ACM has been involved in ORCID from the start and we have recently made a commitment to collect ORCID IDs from all of our published authors. The collection process has started and will roll out as a requirement throughout 2022. We are committed to improve author discoverability, ensure proper attribution and contribute to ongoing community efforts around name normalization; your ORCID ID will help in these efforts.